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mobile-handheld
Modern mobile handheld devices produce a large amount of heat, especially when operating large software. If heat cannot be transferred effectively, operation speed will be negatively affected.
Varieties of AMG thermal interface materials are applied to the mobile handheld industry. For example, by putting thermal pads between mobile phone chips and shielding covers, heat can be better transferred out to decrease the temperature of chips. Without outgassing silicon oil, circuit boards will not be polluted. Painting thermal conductive gel/putty on mobile phone processors and then fixing with metal heat sinks can effectively decrease the temperature of processors.
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