Reflow Oven, GSD-S8C

Reflow Oven, GSD-S8C
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Fully-Automatic Reflow Oven, Small-Size Reflow Oven, Reflow Soldering System

Technical Parameters
Items Parameters
Heating zones 16
Length of heating zone 2760mm
Heating method Hot air infrared
Cooling method Air cooling
Width of PCB 350mm
Conveyor direction Left to right
Conveyor height 880±20mm
Conveyor method Mesh belt
Conveyor speed 0-2000mm/min
Power supply 5-wire 3-phase 380V 50HZ
Total power 7KW/25KW
Heating time 15 minutes
Temperature control Room temperature-300℃
Temperature control method PID closed-loop control system, SSR
Temperature control accuracy ±1℃
Temperature difference of PCB ±2℃
Alarm Temperature anomaly
Dimensions (L*W*H) 4030*700*1400 mm
Weight 450KG
Main Configurations
PLC, temperature controller, communication module GrandSeed PCBASE reflow oven control software V1.0
Computer Lenovo E4300
Motor of gearbox Panasonic, 40W, 1: 150K
Motor of heating device Taiwan Sanyue, 25W
Intermediate relay OMRON
Heating tube Taizhan, nicrhome wire stainless cooling fin
Solid-state relay Yangji, 40A
AC contactor Schneider
Time relay CKC
Thermocouple Yinguang
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