Reflow Oven, GSD-S8C
Request a Quote
Fully-Automatic Reflow Oven, Small-Size Reflow Oven, Reflow Soldering System
Technical ParametersItems | Parameters |
Heating zones | 16 |
Length of heating zone | 2760mm |
Heating method | Hot air infrared |
Cooling method | Air cooling |
Width of PCB | 350mm |
Conveyor direction | Left to right |
Conveyor height | 880±20mm |
Conveyor method | Mesh belt |
Conveyor speed | 0-2000mm/min |
Power supply | 5-wire 3-phase 380V 50HZ |
Total power | 7KW/25KW |
Heating time | 15 minutes |
Temperature control | Room temperature-300℃ |
Temperature control method | PID closed-loop control system, SSR |
Temperature control accuracy | ±1℃ |
Temperature difference of PCB | ±2℃ |
Alarm | Temperature anomaly |
Dimensions (L*W*H) | 4030*700*1400 mm |
Weight | 450KG |
PLC, temperature controller, communication module | GrandSeed PCBASE reflow oven control software V1.0 |
Computer | Lenovo E4300 |
Motor of gearbox | Panasonic, 40W, 1: 150K |
Motor of heating device | Taiwan Sanyue, 25W |
Intermediate relay | OMRON |
Heating tube | Taizhan, nicrhome wire stainless cooling fin |
Solid-state relay | Yangji, 40A |
AC contactor | Schneider |
Time relay | CKC |
Thermocouple | Yinguang |
Related products
Send Message
Other Products
Most Recent
More
Other Products
Videos