Reflow Oven, GSD-S6C
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Reflow Oven for Electronic Mounting, SMT Reflow Soldering Equipment, PCB Reflow Oven
Technical Parameters| Items | Parameters |
| Heating zones | 12 |
| Length of heating zone | 2100mm |
| Heating method | Hot air infrared |
| Cooling method | Air cooling |
| Width of PCB | 350mm |
| Conveyor direction | Left to right |
| Conveyor height | 880±20mm |
| Conveyor method | Mesh belt |
| Conveyor speed | 0-1200mm/min |
| Power supply | 5-wire 3-phase 380V 50HZ |
| Total power | 4.6KW/20KW |
| Heating time | 15 minutes |
| Temperature control | Room temperature-300℃ |
| Temperature control method | PID closed-loop control system, SSR |
| Temperature control accuracy | ±1℃ |
| Temperature difference of PCB | ±2℃ |
| Alarm | Temperature anomaly |
| Dimensions | L3350*W700*1400mm |
| Weight | 350KG |
| PLC, temperature controller, communication module | GrandSeed PCBASE reflow oven control software V1.0 |
| Computer | Lenovo E4300 |
| Motor of gearbox | Panasonic, 40W, 1: 150K |
| Motor of heating device | Taiwan Sanyue, 25W |
| Intermediate relay | OMRON |
| Heating tube | Taizhan, nicrhome wire stainless cooling fin |
| Solid-state relay | Yangji, 40A |
| AC contactor | Schneider |
| Time relay | CKC |
| Thermocouple | Yinguang |
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