Vitrified bond Grinding Wheel for Polycrystalline silicon
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This product has been discontinued and removed from our shelves.
Grinding is a process that removes metal by using irregularly shaped abrasive particles that act on the surface of a metal product.
The vitrified bond grinding wheel is suitable for lapping monocrystalline and polycrystalline silicon materials and wafers. The vitrified bond ensures the grinding wheel features an excellent heat resistance, thus ensuring workpieces will have an excellent surface smoothness. Diamond type and CBN type grinding wheels are available for customers to choose from.
Features
- Excellent heat resistance.
- Excellent sharpness.
- High grinding efficiency.
- Good surface smoothness.
6A2 grinding wheel
| Outer diameter | Overall thickness(mm) | Arbor hole diameter(mm) | Arbor hole width(mm) | Abrasive thickness(mm) |
| 75 | 25 | 19.05/20 | 1.5/3 | 6/10 |
| 100 | 25/30 | |||
| 125 | 31.75/32 | |||
| 150 | 30/35 | |||
| 175 | ||||
| 200 | 35/40/50 | 31.75/32/75 | ||
| 250 | ||||
| Note: other specifications can be customized upon request! | ||||
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