Thermal Silicone Potting Compounds, JF-6606

Thermal Silicone Potting Compounds, JF-6606
Thermal Silicone Potting Compounds, JF-6606
Thermal Silicone Potting Compounds, JF-6606
Thermal Silicone Potting Compounds, JF-6606
Thermal Silicone Potting Compounds, JF-6606
Thermal Silicone Potting Compounds, JF-6606
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Thermally conductive silicone potting compound is a two-component organic silicon potting adhesive. It fully complies with the EU ROHS directive and SVHC-REACH requirements. Upon mixing, it undergoes an addition reaction to form a high-performance elastomer. This product is designed for harsh environments where waterproofing, moisture resistance, corrosion resistance, and shock absorption are necessary.

The curing speed of this compound is adjustable, and its deep-curing feature is not affected by the environment. Characterized by good thermal conductivity and electrical insulation properties, it is suitable for internal component heat dissipation in high-powered devices, integrated circuit boards, electric vehicle charging column modules, lithium battery packs, photovoltaic inverters, LED power drive modules, and similar applications.

This potting compound is an excellent option for casting, potting, insulation, and sealing large-area and deep-sealed parts, boasting exceptional electrical, high, and low-temperature resistance characteristics.

Technical Parameters
Appearance and Physical Properties
Item Stand Part A Part B
Appearance Visual Inspection White or black liquid White liquid
Viscosity (cps,25℃) GB/T 10247-2008 2500 ±500 2000 ±500
Density (mpa.s) GB/T 15223- 1994 1.2~1.4 1.2~1.4
Mix Ratio Weight A:B=1:1
Mixed System Viscosity (cps, 25℃) GB/T 10247-2008 1500~2000
Useable Life (25℃) GB/T 10247-2008 40 mins
Gel Time (25℃) GB/T 10247-2008 1-2 hours
Cure Time GB/T 10247-2008 8 hours (25℃) or 30 mins (80℃)
Cured System
Item Stand Part A Item
Appearance Visual Inspection Gray or black elastomer
Hardness (ShoreA,24hr) GB/T 531-2008 55 ±5
Thermal Conductivity (W/mK) GB/T 10297- 1998 ≥0.8
Tensile Strength (Mpa) GB/T 528-2009 ≥1
Dielectric Strength (kV/mm) GB/T 1695-2005 ≥20
Volume Resistivity (Ω.CM) GB/T 1692-92 1.0 x1014
Elongation (%) - 70
Dielectric Constant(60Hz) GB/T 1693-2007 3.5
Working Temperature Range (℃) GBT 20028-2005 -60~250

PS: The useable life and cure time are tested based on a 100g adhesive dosage.
All data regarding the cured system are measured after the adhesive is cured for 5 days under conditions of 25℃ and 55% relative humidity. This product has a yellowing resistance of over 36 months and an aging lifespan of 50 years.

Packaging:

The packaging specification is 50kg per set, which includes 25kg/barrel of component A and 25kg/barrel of component B.

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