Medium-Wall Heat Shrink Tubing (Dual Wall)
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CYG-HWTA
Semi-Rigid Electronic Insulation Heat Shrink Tubing for Communications
- Outer jacket: Cross-linked modified polyolefin
- Inner wall: Modified hot melt adhesive
- Shrink ratio: 3.5:1, 4:1
- High shrinkage ratio, accommodating larger diameters
- Black outer layer with high UV resistance
Applications
- The polyolefin material used in our tubing offers superior electronic insulation and mechanical protection. With its high shrinkage ratios, this heat shrink tubing is ideal for connecting a wide range of wire bundles or components.
- Its thick wall design is especially suitable for electronic insulation and mechanical protection of medium and high-voltage power cables. The inner layer's hot-melt adhesive provides waterproof sealing for connected components.
Features
- High shrinkage ratio, accommodating larger diameters
- Black outer layer with high UV resistance
- Semi-rigid polyolefin material for superior electronic insulation and mechanical protection
- Lowest full shrink temperature: 135°C
Properties | Test Method | Performance |
Continuous operating temperature (℃) | IEC 216 | -55~110 |
Tensile strength (MPa) | ASTM D2671 | ≥14 |
Ultimate elongation (%) | ASTM D2671 | ≥400 |
Heat aging | 150℃, 168h | - |
Tensile strength after aging (MPa) | ASTM D2671 | ≥12 |
Ultimate elongation after aging (%) | ASTM D2671 | ≥300 |
Volume resistivity (Ω·cm) | IEC 93 | ≥1.0*1014Ω·cm |
Dielectric strength (kV/mm) | IEC 243 | ≥20 |
Longitudinal change (%) | UL224 | 0~10 |
Concentricity (%) | ASTM D2671 | ≥65 |
Cracking resistance | ASTMD1693(50℃) | No cracking |
Water absorption (%) | ISO 62 | 0.2 |
Hot melt adhesive | ||
Softening point (℃) | ASTMD E28 | 85 |
Peel strength (PE) | DIN 30672 | ≥4 |
Copper stability (%) | ASTMD2671 | No corrosion |
Resistance to fungus and decay | ISO 846 | Pass |
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