CVD Diamond Wafer
The skills of diamond film growing technology developed by lapping, polishing, laser cutting. Our CVD diamond wafer has owned many patents in producing and processing field.
The thick of our CVD diamond wafer is 0.3-3mm, and the maximum diameter is 200mm. It can be used in machine cutters, diamond dressers, diamond wire drawing die blanks, electronic components, heat spreaders and other fields. According to different usages, this CVD diamond wafer can meet the customers' extent needs in abrasion ratio, fracture resistance, purity, thermal conductivity, and so on.
We are a China-based CVD diamond wafer manufacturer and supplier. We offer a variety of products, including our PCD saw blade, PCD reamer, tungsten carbide supported diamond die blanks, carbide scribing wheel, and more.
