Grinding Wheel for Ceramic Encapsulation Material
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Grinding wheels for ceramic encapsulation material are primarily used for planning or outer diameter grinding on ceramic encapsulation devices made of corundum or carborundum. They are also used for plane or surface grinding on carbide alloy products.
Technical Parameters:| OUTER DIAMETER (D) | OVERALL THICKNESS (T) | EFFECTIVE GRINDING WIDTH (K) | EFFECTIVE GRINDING THICKNESS (X) |
| 300 | 5-40 | 10 | 5-40 |
| 350 | 7.5 | ||
| 400 | 10 | ||
| 450 | 10 |
Remark: Other specs are available upon request.
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