Epoxy Potting Compounds, 5508

Epoxy Potting Compounds, 5508
Epoxy Potting Compounds, 5508
Epoxy Potting Compounds, 5508
Epoxy Potting Compounds, 5508
Epoxy Potting Compounds, 5508
Epoxy Potting Compounds, 5508
Epoxy Potting Compounds, 5508
Epoxy Potting Compounds, 5508
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JF-5508W White Low Viscosity Epoxy Resin
JF-5508W Black Low Viscosity Epoxy Resin

Two-component epoxy resin is an environmentally friendly epoxy resin potting adhesive that can cure at room temperature or with heating. Fully compliant with the EU ROHS directive and SVHC-REACH requirements, it has low viscosity, a long working time, good flowability, and can easily penetrate into gaps in products. After curing, it features no bubble, a smooth surface, good gloss, high hardness, excellent acid and alkali resistance, moisture-proofing, waterproofing, oil resistance, and dust resistance, as well as resistance to humidity, heat, and atmospheric aging. This potting compound possesses excellent electrical and physical properties such as insulation, compression resistance, and high bonding strength. It can be used for potting, sealing, and encapsulation protecting electronic or other products that require insulation, moisture-proofing, and sealing.

Application

This epoxy resin widely used in transformers, resistors, sensors, thermostats, ignition coils, high-voltage packs, aquarium equipment, negative ion generators, ultrasonic atomizers, as well as electronic and electrical components that require insulation, flame resistance, and temperature resistance. Its main functions include flame-retardant insulation, sealing bonding, moisture-proofing, shock resistance, and temperature durability.

Technical Parameters
Liquid Properties
Item Stand Part A Part B
Appearance Visual Inspection Black or white liquid Reddish-brown or clear liquid
Viscosity (cps,25℃) GB/T 10247-2008 5500~7500 200±50
Gravity (g/cm3) GB/T 15223- 1994 1.4~1.5 1.05
Mix Ratio Weight A:B=5:1
Mixed System Viscosity (cps,25℃) GB/T 10247-2008 2000~3000
Useable Life (25℃) GB/T 10247-2008 40±10 mins
Gel Time (25℃) GB/T 10247-2008 2-3 hours
Cure Time (25℃) GB/T 10247-2008 25℃/12-24 hours or 60-80℃/1-1.5 hours
Cured System
Item Stand Part A Part B
Appearance Visual Inspection White or black solid
Hardness (Shore D) GB/T 531-2008 80~90
Tensile Strength (kg/cm2) GB/T 6328-1999 16~18
Compressive Strength (kg/cm2) GB/T 17517-1998 18~22
Voltage Withstand (kV/mm) GB/T 1695-2005 20~22
Volume Resistivity (Ω.CM) GB/T 1692-92 1.1 x 1015
Surface Resistivity (Ω.CM) GB/T 1410-2006 1.2 x 1014
Water Absorption (%) - < 0.03
Temperature Range (℃) GB/T 20028-2005 -30~130
Shrinkage (%) GB/T 15585-1995 0.35~0.55
Packaging:

The packaging specification is 30kg per set, which includes 25kg (in barrel) of component A and 5kg (in pot) of component B.

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