Jufeng Mini LED Solder Paste is our new solution for mini LED soldering, designed to provide superior workability while ensuring higher reliability.

As a lead-free solder paste for mini LED printing process, JF-ML100 adopts a unique flux formulation technology with ultra-fine powder size solder powder. This solder paste has a wide process window, great product stability, and performs well in a variety of applications.

• Esports monitor
• Notebook computer
• Car display
• Outdoor commercial display
• TV (high brightness, high refresh rate, local dimming)
• VR glasses (high separate rate and high refresh rate)

• High sphericity of tin powder & concentrated particle size
• Long stencil printing life (>10h)
• Good shear strength for solder joint and high reliability
• Low voids
• Excellent void performance after reflow
• Low and clear residue of solder paste flux. The residue and substrates metal do not change color or have an impact on the LED's luminous quality after being placed in a constant temperature chamber at 40°C for 240 hours.
• High thermal and electrical conductivity, the thermal conductivity of SAC305 alloy is about 54W/ m·K.
• Good thixotropy, good dispersion, and the optimum viscosity needed for curing and printing
• Follow the recommended reflow profile parameter setting, it will benefit for soldering and reduce die tilt & die shift issue.
• The cost of curing solder paste is much lower than silver glue and Au80Sn20 alloy, and the curing process saves energy.
• The particle size is 5-15μm for No.6 powder, 2-12μm for No.7 powder

Note: About the particle size of tin powder. All tin powder particle size distributions refer to 95% of the sizes within the specified range. Inevitably, there will be a small number of out-of-range sizes (>15μm or <2μm).

• Syringe packaging: 30cc/50g for each; available for packing according to customer's requirements.
• Label printing: factory name, product name, model number, production batch number, shelf life, weight.
• Shelf life: 6 months
• Please store in sealed condition at temperature 2-10°C and relative humidity 35-70%.

• Before using, warm up the solid crystal solder paste for a minimum of two hours at room temperature (about 25°C).
• When using, make sure to avoid water droplets to immerse in the solder paste, mixing with water vapor will affect its characteristics.
• Due to solvent evaporation, the surface of the wet solder paste is easily dried. So after opening the lid, it is recommended to shorten the exposure time in the air as much as possible. If the solder paste in the syringe cannot be used completely at once, please refrigerate the remaining solder paste in the syringe as required.
• Curing equipment can be a printing machine or a curing machine.