Grinding wheels for Manufacturing of Silicon Wafers
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This product has been discontinued and removed from our shelves.
The metal bond grinding wheel is specially designed for the rough grinding, fine grinding and chamfering of GaAs, silicon wafers, etc.
Specification
| Outer diameter (mm) | Overall thickness (mm) | Arbor hole diameter (mm) | Fillet radius (mm) | Abrasive width (mm) |
| 100 | 6/8/10 | 25.4/31.75/32 | Customized | 1-10 |
| 125 | ||||
| 150 | ||||
| 180 | ||||
| 200 |
Note: other specifications can be customized upon request!
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