Copper/PI Shielding Tape
Polyimide film laminated copper foil
- Total Thickness: (10μm to over 100μm) ±3μm
- PI Layer Thickness: (≥2μm) Copper Layer (≥0.1μm)
- Tensile Strength: ≥30Mpa
- Width: 0.5mm to 990mm
- Elongation: ≥30% Min
- Packaging: rolls(D30), sheets, 76mm removable rolls, inverted cone packaging
Copper/PI shielding tape is a polyimide film laminated with a copper foil layer, widely used in flexible printed circuits (FPC). It exhibits excellent physical, chemical, and electrical properties, is resistant to atomic radiation, solvents, low and high temperatures, and operates successfully over a wide temperature range, from as low as -452°F (-269°C) to as high as 752°F ( 400°C). Due to its unique and outstanding performance, the Copper/PI shielding tape is the preferred choice in many insulation applications.
Polyimide (PI) plastic is currently one of the best heat-resistant engineering plastics, with some varieties capable of withstanding high temperatures of 290°C for extended periods and short-term exposure to temperatures as high as 490°C. Additionally, it offers good mechanical properties, fatigue resistance, flame resistance, dimensional stability, electrical performance, low molding shrinkage, resistance to oils and common acids, as well as organic solvents. However, it is not alkali-resistant but has excellent friction and wear resistance.
- Ease of Coating
- Flame retardant, radiation resistance, and thermal insulation.
- High-temperature insulation
- High adhesion strength and dielectric strength
- Outstanding voltage resistance and tensile strength
- Perfect balance of electrical, chemical, and physical properties
- Thin and heat-resistant parts for fastening and electrical insulation
- Used in TAB bonding (tape automatic bonding), heat-resistant films, etc
- Flame retardant materials
- Thermal insulation materials
- Data transmission cable
- EMI shielding
