Lead Frame Stamping Press
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Metal stamping machinery for the production of semiconductor lead frames
Primarily used for the production of lead frames in semiconductor and IC packaging. Mechanical Press maintains high linear guidance precision during high-speed strokes, making it suitable for challenging lead frame processing such as micro-pitch and ultra-thin materials. It provides stable and reliable production capabilities for industries including LED and IC packaging.
Straight Side Knuckle Joint Press (40 ton), MARX-40T
Samples of Stamped Parts
Technical Specifications
| Press capacity (kN) | 400 |
| Stroke (mm) | 16/20/25/30 |
| Stroke speed | 200-1250/200-1200/200-1050/200-900 strokes per minute |
| Shut height (mm) | 190-240 |
| Slide adjustment (mm) | 50 |
| Slide area (mm) | 600×300 |
| Worktable size (bolster) (mm) | 600×400 |
| Worktable thickness (mm) | 90 |
| Worktable opening (mm) | 400(upper)×350(lower)×60 |
| Bed opening (mm) | 400×100 |
| Motor (kW) | 11×4P |
| Upper die weight | max. 80kg |
| Total weight (kg) | 6500 |
| Dimensions (mm) | 1780×3075×1210 |
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