Thermal Conductive Putty
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Thermal Conductive Putty
AMG’s GPU series thermal conductive putty features a strong plasticity and can be used to fill uneven gaps between heating components and heat sinks or shells in order to efficiently and effectively lower electronic component temperatures.
FeaturesAMG provides a variety of GPU thermal conductive putty and customization services.
- High thermal conductivity, max. 6.0 W/m·K
- Suitable for automatic dispensing
- Soft, highly compressible and highly plastic, allowing it to uniformly cover component surfaces without holes.
- Excellent insulation
- No flowing, no curing, no volatilizing, non-stick
- High and low temperature resistant, water steam resistant, aging resistant
- Adjustable parameters and packaging scales
- RoHS, REACH certifications
- Computer server: microprocessors, cache chip
- Portable electronic equipment: game player
- Communication devices: wireless module, router
- Household appliances: LCD TV
- LED Lighting equipment
- Power supply
- Heat pipe radiator
- Thermal conductivity: 1.0~6.0 W/m·K
- Temperature range: -55~+200 ℃
- EFD syringe, sealed can, 25 kg pail
- Suitable for automatic dispensing
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