Solder Sphere
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Solder spheres are suitable for BGA (ball grid array), CSP (chip scale packages), semi-conductor packaging, SMT rework repair, etc.
Specifications- Main elemental composition: Tin (Sn) 96.5, silver (Ag) 3.0, copper (Cu) 0.5;
- Alloy density: 7.4g/cm3 ( 20℃);
- Solidus and liquidus temperatures: 217℃～219℃;
- Temperature: 300℃ 10℃/-0℃; Anti-oxidation time: 30min 5min/-0min；
- The liquid tin always remain silvery-white;
- Features: Phosphorus free, good solderability and high resistance to oxidation;
Silvery-white, smooth surface, no impurity, low color difference for each batch (△E＜0.3), fully spherical in shape;
Size and Tolerances (Unit: μm)| Diameter | Tolerance | Diameter | Tolerance |
| ≥500 | ±20 | ＜500 | ±10 |
| Diameter | Sphericity（%） | Diameter | Sphericity（%） | Diameter | Sphericity（%） |
| 100～150 | ≧80 | 351～550 | ≧92 | 651～760 | ≧94 |
| 151～350 | ≧90 | 551～650 | ≧93 | 761～1000 | ≧95 |
| Diameter | Oxygen Content (%) | Diameter | Oxygen Content (%) |
| ≦300 | ≦0.0026 | ＞300 | ≦0.0015 |
Anti-oxidation test
Reflow soldering test
High temperature and humidity test
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