Solder Powder
Our Solder Powder can be often found in the LED circuit boards, assorted lighting fixtures, computer mainboard, mobile phone motherboards, sundry precise circuit boards, printed circuit boards, SMT components, as well as the plug-in boards. It is a first choice of repairing the mini-sized electronic instruments. In addition, the tin powder is an indispensable material for producing the solder paste.
Our solder powder is a kind of grey or grayish-white solid powder with its particle size from 2µm to 75µm. Each bag can hold the product of 5kg weight. The diameter of our solder ball ranges from 2cm to 3cm, and the tin hemisphere is also available. Our ball should be kept in cold storage at the temperature range from zero to 10℃. It can reach the optimal state at the temperature range from 5℃ to 7℃.
We also have developed , for high performance semiconductor devices that require low alpha packaging solutions.
Uses
The Solder Powder are primarily used for the manufacturing of the electrical carbon products, friction materials, oil bearings, and the powder metallurgy materials. Our product comes with various models, including Sn63Pb37, Sn62Pb36Ag2, Sn96.5Ag3.0Cu0.5, Sn42Bi58, Sn64Bi35Ag1, and more. Moreover, the pure tin anode rod made by our company is fit for use in the electroplating industry.
High Reliability
Our Solder Powder have not only passed the SGS test, but also achieved RoHS, REACH, and other certifications. Moreover, this product is provided with the related material safety data sheet, abbreviated as MSDS. Our lead-free tin powder has been exported to Egypt, Russia, Lithuania, Poland, and other countries. In addition, we are searching for more agents around the world. Welcome to consult us, if you show interest in our solder products.
- Due to the soft errors and upsets from alpha particle emissions in electronic devices from solders, the packaging for high-density, miniaturized device such as SiP system and flip chip require low alpha packaging solutions.
- Utilizing advanced international techniques, such as high-speed centrifugal atomization and ultrasonic atomization, this spherical tin-based solder powder is produced with consistent particle size and low oxygen content. These characteristics improve the solder paste’s spreading and wetting properties, ensuring reliable and even solder joints.
| Application Characteristic | IPC Alloyed Powder Type | Size of Alloyed Powder | Content of Alloyed Powder |
| Standard Printing | No.3 powder | 25~45μm | 89% |
| Fine-Pitch Printing | No.4 powder | 20~38μm | 88.50% |
| Instillation | No.3 powder | 25~45μm | 85% |
| Standard printing | No.6 powder | 5-15um | 89% |
| Standard printing | No.7 powder | 2-11um | 89% |
| Standard printing | No.8 powder | 6-2um | 89% |
| Standard printing | No.9 powder | 4-1um | 89% |
| Packing Specification | 5kg/bag, 4 bags/box |
| Packing Material | The inner layer is a plastic bag, and the outer layer is a hard plastic box. These two layers are adopted to guarantee the safety of transportation. |
| Dimension of Carton (Length*Width*Height) | 18.5*18.5*18.5cm |
| G.W. | 20kg |
| MOQ | 50kg |
| Production Capacity | We can supply 80 tons of solder powder each month. |
| Others | We can track your order 24 hours a day, and inform you of the production process in time. |
Related Names
Alloy Soldering Powder | Tin Powder | Soldering Tin Ball
