JL-CS-F01 Copper Conductive Paste
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JL-CS-F01 conductive copper paste is a solvent-free, 100% solids formulation. It effectively fills vias densely while preventing voids and cracks. The paste maintains stable electrical conductivity, with a volume resistivity of less than 10⁻⁴ Ω·cm, and offers excellent reliability at high temperatures. Its low-temperature curing capability allows it to cure at relatively low temperatures, making it compatible with various temperature-sensitive substrates. With its superior via filling quality and process stability, this conductive paste is an ideal choice for high-reliability electronic packaging applications that require strict via filling performance and consistent manufacturing results.
Applications- Cu-pillar Replacement: Reliable interconnect for advanced packaging
- Gap Control: Copper via formation enabling precise gap filling
- Any Layer Interconnect: Vertical vias for multilayer PCB designs
- TMV: Through Mold Via for stacked dies
- TGV: Through Glass Via for glass substrates
- Board-to-Board Interconnect: Seamless connections between PCB assemblies
| Avg. Thermal Resistance( Ω·cm) | Change (%) | ||
| Initial Data | After 12 Reflow Cycles | ||
| Average | 7.2×10⁻5 ( Ω·cm) | 7.5×10⁻5 ( Ω·cm) | ＜5% |
| Item | Data |
| Model | JL-CS-F01 |
| Solid content | 100% |
| Volume resistivity | ＜10⁻⁴ Ω·cm |
| Glass transition temperature (Tg) | 160℃ – 190℃ |
| CTE (Tg) | 110 – 130 ppm |
| Total Expansion at 260℃ | 1.5 – 2.0% |
| curing temperature | 180℃ |
| curing time | 60 min |
| Storage temperature | −10℃ – 0℃ |
| Shelf life | 3 months |