FC-100U Pressure Copper Sinter Paste
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FC-100U is a copper paste suitable for pressure sintering process. It has excellent conductive characteristics and can maintain operation stability in the long printing process. After sintering, the copper layer is uniform and dense, providing high reliability and high thermal conductivity for the bonding of power device chip.
Features- High thermal conductivity
- High electrical conductivity
- High shear strength
- High operation temperature
- REACH and RoHS Compliant
| Item | Data | Appendix |
| Viscosity | 4±1Pa·s | @100s-1 Tested by rheometer |
| Density | 3.5g/cm3 | Before sintering |
| Solid Content | 73~77% | TGA |
| CTE | 14ppm/K | TMA |
| Thermal Conductivity | ＞220W/m·K | Laser flash |
| Resistivity | ＜9μohm·cm | Four-point probe |
| Elastic | 20-30GPa | ASTM E2546 |
| Melting Point | 1084℃ | DSC |
| Applicable Surface | Ag/Au/Cu | |
| Storage Temperature | Freezing or refrigeration | Freezing: -20~0°C Refrigeration: 0~10°C |
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