PL-400CP Non-pressure Silver Sintering Paste for Bare Copper
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PL-400CP is a silver paste suitable for non-pressure sintering process in cooper surface. Featuring excellent conductive characteristics, and stable dispensing performance, the silver layer is uniform after sintering, which can quickly dissipate heat for high-power devices. In addition, its thermal conductivity performance is much better than the traditional solder.
Features- High thermal conductivity
- High electrical conductivity
- Steady dispensing performance
- Excellent RBO control
- 5G station (PA)
- High power LEDs
- SiC discrete device
| Item | Data | Remark |
| Viscosity | 9±2Pa.s（25℃） | @100s-1 tested by rheometer |
| Density | 4.8g/cm³ | Before sintering |
| Solid Content | ＞80% | TGA |
| CTE | 14.37 ppm | TMA |
| Thermal conductivity | ＞200W/m.K | Laser Flash |
| Resistivity | ＜6μohm.cm | / |
| Applicable surface | Ag or Au | / |
| Storage temperature | -10℃ ~ 0℃ | / |
| Melting point | 961℃ | DSC |
| Operating lifespan | 8 hours | @19-25℃ |
| Shelf life | 6 months | / |
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