JL-CS01 Copper Conductive Paste

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Website: http://jfsolder.com/14-copper-conductive-paste.html

Conductive copper paste is a low-temperature curable material designed for advanced electronic applications. Engineered to deliver superior electrical conductivity and reliable solderability, it ensures consistent performance across diverse assembly and manufacturing environments.

Features

Low-Temperature Curing: Minimizes thermal stress on components.
High Conductivity: Provides efficient and stable current flow.
Solder Compatibility: Excellent bonding with both Sn/Pb and lead-free solders.
Long-Term Stability: Retains solderability and performance even after long-term storage.

Applications

Electronic packaging
PCB repair and rework
Solar cell interconnections
RF component assembly
Flexible printed circuits (FPC)
Other high-precision electronic manufacturing processes

Parameters

Item	Data	Notes
Appearance	Brown paste	Visual inspection
Viscosity	18 ± 2 Pa·s @ 20 rpm (25℃)	Measured with Brookfield viscometer
Solid content	>80%	TGA
Curing Conditions	150℃；30~60min	Hot air circulation oven
Specific Resistance Value [Ω·cm]	< 1×10⁻⁴	/
Applicable surface	Metal/ceramic/plastic	Recommended: PET or PI films for plastics; copper or silver for metals
Solderability	Excellent	Compatible with solder wire and solder paste
Application process	Screen / Stencil printing	150–400 mesh polyester screen, thickness 20–50 μm
Storage temperature	0℃ – 10℃	/
Shelf life	3 months	Store below 10℃