Clean Non-Oxidizing High Temperature Chamber

Clean Non-Oxidizing High Temperature Chamber
Request a Quote

Clean non-oxidizing high temperature chambers can prevent products from oxidation under high temperature. It is ideal for application in semiconductor, liquid crystal, electronic products and precision appliance industries.

Reference Standards
  • GB/T2423.2-2008 Environmental Testing for Electric and Electronic Products - Part 2: Test B: High Temperature Test Method
  • GJB150.3A-2009 Military Equipment Laboratory Environment Test Method Part 3: High Temperature Test
  • IEC68-2-2 Test B: Dry heat
  • GB/T 25915.1-2021 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration

Features
  • High temperature resistant high efficiency filter, keeping the internal Cleanliness level of the high temperature chamber (in a class 10000 cleanroom) at grade 100 through vertical circulation.
  • Circular arc in the chamber designed to prevent accumulation and settlement without dead angle.
  • The inner chamber adopts jacket design, ensuring the cleanliness of the inner chamber during cooling.
  • Using air to achieve rapid cooling, saving a lot of nitrogen compared with traditional models.
  • Special temperature controller.
  • Small temperature fluctuation and deviation.
  • Manually adjusted nitrogen flow and display of the float flowmeter scale
  • The solenoid valve controls the nitrogen flow to decrease when the temperature is stable (after oxygen content is reached).
Optional Function
  • Automatic regulation of inert gas flow by electronic flowmeter software
  • Online oxygen concentration analyzer
Specifications
Model SVC-NO-91 SVC-NO-216 SVC-NO-512
Effective Volume (L) 91 216 512
Temp. Range (℃) Min RT 30
Max 250 350 250 350 250 350
Temp. Uniformity (℃) ≤3.0
Temp. fluctuation (℃) ≤ ±0.5
Temp. deviation (℃) ±1.5
Cleanliness level Class 100 (environment cleanliness level class 10000)
Residual oxygen concentration in the chamber 20 ppm minimum (depending on the purity of inert gas used)
Consumption of high-purity inert gas (N2) when the residual oxygen concentration in the chamber≤100ppm ≤30L/min (≤40min down to) ≤60L/min (≤40min down to) ≤120L/min (≤40min down to)
≤7L/min (concentration maintaining) ≤14L/min (concentration maintaining) ≤28L/min (concentration maintaining)
Consumption of high-purity inert gas (N2) when the residual oxygen concentration in the chamber50ppm ≤30L/min (≤60min down to) ≤60L/min (≤60min down to) ≤120L/min (≤60min down to)
≤10L/min (concentration maintaining) ≤20L/min (concentration maintaining) ≤40L/min (concentration maintaining)
Cooling rate (℃/min) 250℃ series, no load, from 225 ℃ to 60 ℃, ≤100min
350℃ series, no load, from 350 ℃ to 60 ℃, ≤180min
Heating rate (℃/min) no load, from RT 15 ℃ to 200 ℃, ≤60min
Internal Dimensions(mm) w 450 600 800
h 450 600 800
d 450 600 800
External dimensions(mm) W 950 1050 1100 1200 1300 1400
H 1560 1660 1710 1810 1910 2010
D 1450 1550 1600 1700 1800 1900
Maximum power (not the sum of all power) (KW) 2.5 3.5 4.5 5.5 7.5 8.5
Leakage switch 4P (A) 10 10 10 16 16 16
Noise (dB) Less than 65 dB (measured 500 mm from the display screen)
Related products
Send Message
Other Products
Inquiry
Inquiry