Chip Mounter, SM482

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Pick & Place Machine, Chip Mounting Machine, SMT Placement Machine

Major Features
1. A replacement speed of 28,000 CPH has been designed in this pick and place machine by using 6-head placement device.
2. The correcting system assures precise positioning and alignment, leading to reliable mounting.
3. Accurate positioning of workpieces of irregular shapes is ensured by the most up-to-date positioning device.
4. Stable feeding and least possible energy consumption have been assured by the vacuum pump.
5. High-precision and high-speed operation is realized.

Technical Parameters

Model			SM482
Positioning			Moveable sensor fixed sensor
Placement device			6 heads × 1
Placement speed			28,000 CPH
Placement precision	Chip/QFP		±50μm＠μ 3σ/Chip, ±30μm＠μ 3σ/QFP
Components	Movable sensor	FOV 16 (Optional)	0402(01005 inch)-□14mmIC, Connector( Pin spacing: 0.4mm) BGA, CSP( Distance between solder balls: 0.5mm)
		FOV 25 (Standard configuration)	0603(0201inch)-□22mmIC, Connector(Pin spacing: 0.5mm) -□17mmBGA, CSP(Distance between solder balls: 0.75mm)
	Fixed sensor	FOV 35 (Optional)	-□32mmIC, Connector (Pin spacing: 0.3mm) BGA, CSP(Distance between solder balls: 0.5mm) -□55mm(MFOV)
		FOV 45 (Standard configuration)	-□42mmIC, Connector(Pin spacing: 0.4mm) BGA, CSP(Distance between solder balls: 1.0mm) -□55mm(MFOV), -□75mm connector
	Max. height		15mm
PCB size	Minimum (L×W)		50mm × 40mm
	Maximum (L×W)		4460mm× 400mm, 510mm×460mm 610mm×510mm, 740mm× 460mm
	PCB thickness		0.38-4.2 mm
Feeder			120ea/112ea
Electricity	Power supply		AC200/208/240/380/415V (50/60Hz, 3Phase)Max.4.7kVA
	Air pressure		0.5-0.7MPa(5-7kgf/cm2)180NL/min, 50NT/min
Weight			Approx.1,600 kg
Dimensions			1,650mm×1, 5680mm×1, 530mm