Non-Pressure Silver Sinter Paste
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- The JF-PMAg01 is a nanosilver paste designed for pressureless sintering processes. It exhibits excellent electrical conductivity and maintains a stable amount of adhesive during extended dispensing processes. After sintering, the silver layer formed is uniformly dense, allowing for efficient heat dissipation in high-power devices. Its thermal conductivity far surpasses that of traditional soldering materials.
- PL-400CP is a silver paste suitable for non-pressure sintering process in cooper surface. Featuring excellent conductive characteristics, and stable dispensing performance, the silver layer is uniform after sintering, which can quickly dissipate heat for high-power devices. In addition, its thermal conductivity performance is much better than the traditional solder.
- PL-500LT is a silver paste suitable for non-pressure sintering process at low temperature. Featured by excellent conductive characteristics, and stable dispensing performance, the silver layer is uniform after sintering, which can quickly dissipate heat for high-power devices. In addition, its thermal conductivity performance is much better than the traditional solder.
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