JF-PMAg01 Pressureless Silver Sintering Paste
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The JF-PMAg01 is a nanosilver paste designed for pressureless sintering processes. It exhibits excellent electrical conductivity and maintains a stable amount of adhesive during extended dispensing processes. After sintering, the silver layer formed is uniformly dense, allowing for efficient heat dissipation in high-power devices. Its thermal conductivity far surpasses that of traditional soldering materials.
Features- High thermal conductivity
- High electrical conductivity
- Steady dispensing performance
- Excellent RBO control
| Item | Data | Appendix |
| Viscosity | ＞20 Pa·s | At 0.5 rpm |
| Density | 4.8 g/cm3 | Before sintering |
| Solid Content | ＞80% | TGA |
| Resistivity | ＜6 μΩ·cm | Four-point probe |
| Coefficient of Thermal Expansion | 20 ppm | TMA |
| Thermal Conductivity | ＞200 W/(m·K) | Laser Flash |
| Applicable Surface | Silver | |
| Storage Temperature | -10℃ ~ 0℃ |
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