Pressure Silver Sintering Paste
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- The JF-PMAg02 is a nanosilver paste specifically designed for pressure silver sintering processes. It possesses excellent electrical conductivity and maintains stable performance during extended printing processes. After sintering, the resulting silver layer is uniformly dense, providing high reliability and superior heat conduction for bonding power device chips.
- FC-325LA is a silver paste designed for pressure-assisted large-area sintering processes, offering excellent electrical conductivity while maintaining operational stability during extended printing. It is also compatible with dry or semi-wet bonding processes.
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