PL-500LT Non-pressure Silver Sintering Paste

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Website: http://jfsolder.com/12-3-non-pressure-silver-sinter-paste.html

PL-500LT is a silver paste suitable for non-pressure sintering process at low temperature. Featured by excellent conductive characteristics, and stable dispensing performance, the silver layer is uniform after sintering, which can quickly dissipate heat for high-power devices. In addition, its thermal conductivity performance is much better than the traditional solder.

Features

Pressureless sintering
High thermal and electrical conductivity
High shear strength
Low temperature sintering and high operation temperature

Applications

5G station (PA)
High power LEDs
SiC discrete device

Cross-section analysis

Parameters

Item	Data	Remark
Viscosity	7±2Pa.s（25℃）	@100s-1 tested by rheometer
Density	5g/cm³	Before sintering
Solid content	＞80%	TGA
CTE	20 ppm	TMA
Thermal conductivity	＞200W/m.K	Laser Flash
Resistivity	＜6μohm.cm	/
Applicable surface	Ag or Au or Cu	/
Storage temperature	-20℃ ~ 0℃	/
Melting point	961℃	DSC
Operating lifespan	8 hours	@19-25℃
Shelf life	6 months	/