PL-500LT Non-pressure Silver Sintering Paste
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PL-500LT is a silver paste suitable for non-pressure sintering process at low temperature. Featured by excellent conductive characteristics, and stable dispensing performance, the silver layer is uniform after sintering, which can quickly dissipate heat for high-power devices. In addition, its thermal conductivity performance is much better than the traditional solder.
Features- Pressureless sintering
- High thermal and electrical conductivity
- High shear strength
- Low temperature sintering and high operation temperature
- 5G station (PA)
- High power LEDs
- SiC discrete device
| Item | Data | Remark |
| Viscosity | 7±2Pa.s（25℃） | @100s-1 tested by rheometer |
| Density | 5g/cm³ | Before sintering |
| Solid content | ＞80% | TGA |
| CTE | 20 ppm | TMA |
| Thermal conductivity | ＞200W/m.K | Laser Flash |
| Resistivity | ＜6μohm.cm | / |
| Applicable surface | Ag or Au or Cu | / |
| Storage temperature | -20℃ ~ 0℃ | / |
| Melting point | 961℃ | DSC |
| Operating lifespan | 8 hours | @19-25℃ |
| Shelf life | 6 months | / |
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