Lead Free Reflow Oven, GSD-M8N Manufacturer

Lead Free Reflow Oven, GSD-M8N

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Lead Free Reflow Soldering Oven, Reflow Oven for Electronic Parts, Lead Free Soldering Equipment

Technical Parameters

Items	Specifications
Control system	PC＋PLC
Heating/cooling	16 heating zones 2 cooling zones
Length of heating zone	2750mm
Temperature control	Room temperature-350℃
Temperature control	±1-2 ℃
Temperature difference at three points	±2℃
Cooling method	Forced air cooling 2 independent cooling zones
Width of PCB	30-320mm
Conveyor height	900±20mm
Conveyor method	Guide rails mesh belt
Conveyor direction	Left to right
Conveyor speed	0-2000 mm /min
Width adjustment range of guide rails	30-320 mm
Width of mesh belt	400 mm
Power supply	A3ø380V 50HZ
Total power	10.8/50KW
Dimensions	4600mm(L)960mm(W)1400mm(H)
Net weight	1100KG

Main Configurations

PLC, temperature controller, communication module	GRADNSEED, single-chip microcomputer, (DR-AD24X26Y38/41(STM32F103ZET6)
Computer	Lenovo E4300
Motor of gearbox	Panasonic
Motor of heating device	Taiwan Sanyue 120 W
Cylinder, electromagnetic valve	Airtac
Intermediate relay	OMRON
Frequency changer	Delta, VFD-series
Heating tube	Taizhan, nicrhome wire
Centrifugal fan	Xinfeida, 130FLJ5
U-shape speed sensor	OMRON
Solid-state relay	YANGJI, 40A
Air switch	MITSUBISHI
AC contactor	Schneider
Thermocouple	Yinguang, K-type
PLC, temperature controller, communication module	GRADNSEED, single-chip microcomputer, (DR-AD24X26Y38/41(STM32F103ZET6)