Lead Free Reflow Oven, GSD-M8N

Lead Free Reflow Oven, GSD-M8N
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Lead Free Reflow Soldering Oven, Reflow Oven for Electronic Parts, Lead Free Soldering Equipment

Technical Parameters
Items Specifications
Control system PC+PLC
Heating/cooling 16 heating zones 2 cooling zones
Length of heating zone 2750mm
Temperature control Room temperature-350℃
Temperature control ±1-2 ℃
Temperature difference at three points ±2℃
Cooling method Forced air cooling 2 independent cooling zones
Width of PCB 30-320mm
Conveyor height 900±20mm
Conveyor method Guide rails mesh belt
Conveyor direction Left to right
Conveyor speed 0-2000 mm /min
Width adjustment range of guide rails 30-320 mm
Width of mesh belt 400 mm
Power supply A3ø380V 50HZ
Total power 10.8/50KW
Dimensions 4600mm(L)*960mm(W)*1400mm(H)
Net weight 1100KG
Main Configurations
PLC, temperature controller, communication module GRADNSEED, single-chip microcomputer, (DR-AD24X26Y38/41(STM32F103ZET6)
Computer Lenovo E4300
Motor of gearbox Panasonic
Motor of heating device Taiwan Sanyue 120 W
Cylinder, electromagnetic valve Airtac
Intermediate relay OMRON
Frequency changer Delta, VFD-series
Heating tube Taizhan, nicrhome wire
Centrifugal fan Xinfeida, 130FLJ5
U-shape speed sensor OMRON
Solid-state relay YANGJI, 40A
Air switch MITSUBISHI
AC contactor Schneider
Thermocouple Yinguang, K-type
PLC, temperature controller, communication module GRADNSEED, single-chip microcomputer, (DR-AD24X26Y38/41(STM32F103ZET6)
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