Lead Free Reflow Oven, GSD-M8N
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Lead Free Reflow Soldering Oven, Reflow Oven for Electronic Parts, Lead Free Soldering Equipment
Technical ParametersItems | Specifications |
Control system | PC+PLC |
Heating/cooling | 16 heating zones 2 cooling zones |
Length of heating zone | 2750mm |
Temperature control | Room temperature-350℃ |
Temperature control | ±1-2 ℃ |
Temperature difference at three points | ±2℃ |
Cooling method | Forced air cooling 2 independent cooling zones |
Width of PCB | 30-320mm |
Conveyor height | 900±20mm |
Conveyor method | Guide rails mesh belt |
Conveyor direction | Left to right |
Conveyor speed | 0-2000 mm /min |
Width adjustment range of guide rails | 30-320 mm |
Width of mesh belt | 400 mm |
Power supply | A3ø380V 50HZ |
Total power | 10.8/50KW |
Dimensions | 4600mm(L)*960mm(W)*1400mm(H) |
Net weight | 1100KG |
PLC, temperature controller, communication module | GRADNSEED, single-chip microcomputer, (DR-AD24X26Y38/41(STM32F103ZET6) |
Computer | Lenovo E4300 |
Motor of gearbox | Panasonic |
Motor of heating device | Taiwan Sanyue 120 W |
Cylinder, electromagnetic valve | Airtac |
Intermediate relay | OMRON |
Frequency changer | Delta, VFD-series |
Heating tube | Taizhan, nicrhome wire |
Centrifugal fan | Xinfeida, 130FLJ5 |
U-shape speed sensor | OMRON |
Solid-state relay | YANGJI, 40A |
Air switch | MITSUBISHI |
AC contactor | Schneider |
Thermocouple | Yinguang, K-type |
PLC, temperature controller, communication module | GRADNSEED, single-chip microcomputer, (DR-AD24X26Y38/41(STM32F103ZET6) |
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