FPC Cover Film (Coverlay)
Designed to offer best protection for flexible printed circuit boards (FPCs). Made from high-performance polyimide, this coverlay film guarantees long-lasting protection for the sensitive components of the PCB by shielding the conductive layers from environmental damage like moisture, dust, and pollutants.
Without sacrificing its protective properties, this flexible, strong film can resist bending, folding, and extreme temperature swings. It also guarantees, under demanding circumstances, copper foil on the FPC stays free from oxidation and corrosion. Perfect for uses needing great dependability, the FPC Cover Film is ideal for usage in electronics where durability, performance, and adaptability rule most importantly.
What the Features of FPC Cover Film (Coverlay)
- Polyimide material. Made from a polyimide film, offering excellent flexibility, durability, and reliability for FPCs.
- Protection against environmental factors. Resists temperature, humidity, and corrosive substances, safeguarding your circuits.
- Low-temperature resistance. Withstands freezing, refrigeration, and transportation, ensuring stability in various conditions.
Specifications
Material | Polyimide (Pi) | Polyethylene | Glass Fiber |
Standard thickness (μm) | 10, 12.5, 25, 50, 75 | 20, 50, 75, 125 | 100, 200 |
Operating temperature | 280℃, 10sec | 105℃, 10sec | 280℃, 10sec |
Automatic solder | Possible | lmpossible | Possible |
Flame retardancy | Tolerable UL94V-0 | Tolerable UL94HB | Tolerable UL94V-0 |
Mechanical strength | Easy to crack | Good in greenhouse | Excellent |
Moisture absorption | Easy to get wet | Small | Moderate |
Flexibility | Excellent | Excellent | Poor |
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