Picosecond Laser Glass Cutting Machine, DNP Series
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Features
- Utilizes a picosecond laser with ultra-short pulse processing for no heat conduction, making this laser cutting machine ideal for high-speed glass cutting and drilling with chipping and heat-affected zones within 30μm.
- Supports integrated cutting and splitting or standalone configurations for cutting and splitting.
- Configurable with CCD vision pre-scanning and automatic target positioning.
- Maximum material processing range of 750mm x 550mm.
- Features a stable, corrosion-resistant, moisture-proof, and rust-free marble platform.
- Capable of cutting various thicknesses, irregularly shaped glass, and glass with inner holes over 100mm.
Parameters
| Model | | |
| Laser power (W) | 50/70 | 50/70 |
| Laser wavelength (nm IR) | 1064 | 1064 |
| Working are (mm) | 1200*800 | 600*700*2 |
| X/Y/Z axis positioning accuracy (mm) | ±0.03 | ±0.03 |
| X/Y/Z axis repeatability (mm) | ±0.01 | ±0.01 |
| Laser drilling accuracy (mm) | ±0.02 | ±0.02 |
| Max. drilling speed (mm/s) | 200 | 200 |
| Edge chipping (μm) | < 30 | < 30 |
| Drilling range (mm) | >100 | >100 |
| Cutting thickness (mm) | 1-8 | 1-8 |
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